Product Description

Model SE105 is designed as a piezoresistive pressure sensor die with a flip-chip structure. It is developed for the pressure measurements of absolute pressure reference.

The sensor die is manufactured through 6″ wafer silicon-on-silicon process by MEMS technology. Thanks to the unique flip-chip structure, comparing with the conventional sensor die structure, the SE105 features various superiority: suitable for more harsh environment (because its Wheatstone bridge circuitry cannot be approached by pressure medium), and simplified die bonding process (because the traditional wire bonding process is eliminated and the SE105 can be easily attached onto the circuit as a surface mounting device).

As a non-signal-conditioning sensor die, the standard SE105 is available in a closed-bridge circuit with 4 solder pads for both bridge adjustment and temperature compensation.

Before packing, each SE105 sensor die is individually tested and qualified to its specifications.

3 types of packaging are available as options to fit different marketing demands.

Additional Information