Product Description

Model FD101 is a piezoresistive force sensor die, which is made from monocrystalline silicon and specially designed for force measurement universally or sensor application to measure extreme low-level forces.

This model FD101 force sensor die has its four piezoresistive resistors each laid perpendicularly to the adjacent ones, similar pattern to the EB-type of metal foil strain gauges from BCM SENSOR. As a result, this force sensor die can be used to measure a force in all directions.

For example, if one of such the sensor dies is bonded on a bending beam, it forms a half bridge measuring circuit, or if two of such the sensor dies are bonded on the top- and bottom-surface of the bending beam respectively, they form a full bridge measuring circuit. In case of an either tension or compression beam where this sensor die is bonded on, it can form a full bridge measuring circuit. In addition, if this sensor die is bonded on a shear beam or torsion beam, it can also form a full bridge circuit to measure shear force or torque.

The four piezoresistive resistors of the FD101 force sensor die constitute a full-bridge circuit, resulting in a high sensitivity for low-level force measurement down to a few microstrains.

On the FD101, its Wheatstone bridge circuit is configured to the open-bridge circuit of 5 solder pads, on which gold leads can be attached on request. 5 solder pads also bring advantage to facilitation of its zero-offset adjustment and temperature compensation. As there is no signal-conditioning circuitry on this sensor die, its output signal is directly from its Wheatstone bridge circuit.

Thanks to MEMS technology, the FD101 features a small size (1.3mm x 1.3mm) and capacity of high volume per batch in mass production.

Additional Information

Datasheets

Installation of BCM Strain Gauges for Sensor Applications