BCM SENSOR has recently released a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6” silicon micro-machining process.

Shown in the image are two cross section of the SE105 flip-chip sensor die, which can be used for gauge or absolute pressure measurement:

Thanks to the unique manufacturing process, the flip-chip is realized at the SE105 pressure sensor die, resulting in the following advantages comparing to the conventional-structure of pressure sensor dies:

• Either corrosive or conductive pressure medium can have direct contact with sensor dies;
• Die bonding and wire bonding are simplified to one bonding process of flip-chip;
• Improved resistance to harsh environment

The SE105 flip-chip pressure sensor die features also an outstanding non-linearity of 0.15%fs and an excellent long-term stability of 0.1%fs/year.

For more details about this SE105 flip-chip pressure sensor die, please visit BCM SENSOR website: http://www.bcmsensor.com/mh_search.php?keywords=SE105&Submit2=Search