Product Description

Model SE101 piezoresistive sensor die is specially designed for high-volume applications, e.g., medical devices, automotive industry, and consumer electronics. This sensor die is manufactured through 6″ wafer silicon-on-silicon process by MEMS technology. It features a miniature dimensions of 0.9mm x 0.9mm x 0.5mm. Thanks to its unique design of the pressure diaphragm, the SE101 possesses not only high sensitivity but also extraordinary overload pressure (proof pressure and burst pressure).

As a non-signal-conditioning sensor die, the SE101 is available in a closed-bridge circuit with 4 solder pads.

Before packing, each SE101 sensor die is individually tested and qualified to its specifications.

Three different types of packaging are available as options to fit different marketing demands. These three types can be found in Ordering Information.

Additional Information